The alumina ceramic substrate has high mechanical strength, good insulation and light protection, and has been widely used in multi layer wiring ceramic substrates,electronic packaging, and high-density packaging substrates.
With the continuous development of modern communication technology,electronic components are simplification, miniaturization, and high integration, and the requirements for circuit packaging processes are also increasing,and the demand for alumina ceramic package substrates is also increasing. Alumina ceramics have good performance in terms of strength, heat resistance, impact resistance,electrical insulation and corrosion resistance, and have sufficient raw materials,affordable prices, and perfect manufacturing and processing systems, which play an important role in industrial packaging.
Alumina has many isomorphous crystals, such as α-Al2o3, β-Al2o3, γ-Al2o3,etc. Among them,α-Al2o3 has high stability, compact crystal structure, stable physical andchemical properties, and has the advantages of high density and mechanicalstrength, and is also widely used in industry.
Alumina ceramics are classified by alumina purity. Those whose purity is>99% are called corundum ceramics; those whose purity is around 99%, 95% and90% are called 99 ceramic, 95 ceramic and 90 ceramic; those whose purity is> 85% alumina ceramics are generally referred to as high alumina ceramic.
Black alumina ceramic substrate manufacturing process
Black alumina ceramic substrates are mostly used in semiconductorintegrated circuits and electronic products, mainly because most electronicproducts have high photosensitivity, and the packaging materials have strongopacity to ensure the clarity of digital display. With the continuous updating of modern electroniccomponents, the demand for black alumina packaging substrates has also beenexpanding. At present, countries are actively conducting research on themanufacturing process of black alumina ceramics.
In the ceramic coloring process, the low temperature environment may causethe volatility of the coloring material to be affected and kept warm for acertain period of time. In this process, the free state coloring matter may beaggregated into a spinel compound, which can prevent the coloring material fromcontinuously volatilizing in a high temperature environment, and the coloringeffect is ensured.
The casting method refers to a process in which a solvent, a dispersant, abinder, a plasticizer, and the like are added to a ceramic powder to uniformlydistribute the slurry, and then a ceramic sheet of different specifications isformed on a casting machine, and is also called the blade forming method. Theprocess first appeared in the late 1940s and was used to produce ceramic chipcapacitors. The advantages of this process are: (1) The equipment is simple in operation, efficient inproduction, capable of continuous operation and high in automation level;
(2) The density of the embryo body and the elasticity of the membrane arelarge;
(3) The process is mature;
(4) The production specifications are controllable and the scope is wide. The ceramic substrates used in modern production are mostly multi layer substrates, and the purity of alumina ceramics is 90.0 to 99.5%. The higher the purity of the alumina ceramic used,the better the performance, but the key problem is that the part has higher requirements on the sintering temperature, which leads to an increase in manufacturing difficulty.
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